Pagination: 2/2
Relative Spectral Sensitivity vs. Wavelength (PT-A2-AC-5-PE-850)
Relative Spectral Sensitivity vs. Wavelength (PT-A2-AC-5-PE-850)

Photo Current vs. Illuminance (PT-A2-AC-5-PE-850)
Photo Current vs. Illuminance (PT-A2-AC-5-PE-850)

Dark Current vs. Ambient Temperature (PT-A2-AC-5-PE-850)
Dark Current vs. Ambient Temperature (PT-A2-AC-5-PE-850)
Relative Spectral Sensitivity vs. Wavelength (PT-A2-AC-5-PN-850)
Relative Spectral Sensitivity vs. Wavelength (PT-A2-AC-5-PN-850)

Photo Current vs. Illuminance (PT-A2-AC-5-PN-850)
Photo Current vs. Illuminance (PT-A2-AC-5-PN-850)

Dark Current vs. Ambient Temperature (PT-A2-AC-5-PN-850)
Dark Current vs. Ambient Temperature (PT-A2-AC-5-PN-850)

Bullet Edge Phototransistor (PT-BE) Precaution Usage

Photo Current Measurement Method (PT-BE)
Photo Current Measurement Method (PT-BE)

Lead-forming and cuttings:

  1. Before soldering, perform lead forming at normal temperature.
  2. While forming or cutting the lead, stay the area at a distance of 5 mm or greater from the root of the lead.
  3. Avoid mounting which may cause force on the root of the lead.

Storage:

The sensor is incorporated in the transparent resin package. Because of its sensitivity to humidity, the package is moisture-proof. When storing the sensor, do as instructed below.
  1. Quickly use after opening. (within 2 days, below 30 °C/60 % R.H.).
  2. Once unpacked, use within three months, or keeping within a moisture-proof method, which include maintaining within a moisture-proof container with silica gels, is suggested for longterm safe-keeping.
  3. Very bad storage conditions may deteriorate solderability or characteristics, and defect the appearance. Recommended conditions of the storage place, temperature 0°C to 30 °C, humidity below 60% R.H. (Avoid freezingand dew condensation).

Mounting:

  1. While packages are on one circuit board, avoid mismatching in the thermal expansion of each component, generate cracks in the package and break the bonding wire.

Soldering:

  1. Do not immerse plastic parts in tin tank.
  2. During soldering, when adding thermal stress in a moisture absorbing state, moisture evaporates, swells and generates stress to the internal package.
  3. To avoid swellings and cracks in the surface of the package, followsoldering conditions below.
  4. Wave soldering method: 120°C < 60s、260°C < 5s.
  5. Manual soldering: 260°C < 5s、340°C < 3s.

Cleaning:

  1. Do not wash with water to avoid corrosion.
  2. Under any circumstance, the cleaning time should be within 1 minute of normal temperature.
  3. Alcohol is recommended as a cleaning agent when cleaning products.
  4. If you use other cleaning agents, you need to confirm whether the cleaning agent will corrode the epoxy body.
  5. Freon can not be used as a cleaning agent.
  6. When cleaning products with ultrasonic cleaning, ultrasonic power and time should be less than 300W and 30 seconds, respectively.
  7. PCB and product can not touch the oscillator. Can not make the product on the PCB resonance.
  8. This model is static sensitive devices, so static electricity and surges can damage the product.
  9. To all the equipment, machines, tables, and the ground must be anti-static ground.
  10. Requires the use of anti-static wrist strap wear.
Order Codes (PT-BE)
PT - A2 - AC - 3 - BE - 850
      
Part Number
PT
 
Chip Type
A2
 
Lens Color
AC Water Clear
 
Size
3 3 mm
5 5 mm
 
Shape
BE Bullet Edge
PE Plate Edge
PN Plate None
 
Spectral Bandwidth
850 850 nm