Chip Thin-Film RF Inductors (TRAL)

Chip Thin-Film RF Inductors Provide Small-Format Protection. DeMint (TRAL) chip inductors provide reliable protection against challenging EMI problems in high frequency filtering applications. This miniature wirewound inductor features a low seated height that stands only 0.23mm above the circuit board. It protects sensitive electronic circuitry and ensures high performance operation in a wide range of compact devices that are shrinking ever smaller in physical size.

DeMint (TRAL) series uses a thin-film technology for high reliability and precision tolerances to 1% or ±0.1nH. The (TRAL) thin-film inductor series is available in 0603, 0402, and 0201 sizes, in inductance values from 0.1 to 100nH, in tolerances down to 0.1nH or 1%, and with SRF (self-resonant frequency) tightly controlled.

The technology characteristics make it ideal for the latest cellphone and PDA applications in addition to wireless network and Bluetooth enabled devices.

Application of specific designs also available including different inductance values and Q specifications adjusted to frequency requirements. Customed designs and tighter tolerances are available on request. Thin Film Inductor is mounted in a surface mount package which assures mechanical stability, excellent lead coplanarity, and suitable for automatic pick and place equipment.

The (TRAL) series is lead-free and RoHS compliant. Detailed specifications, both mechanical and electrical, please contact DeMint sales representative for more information. Download Complete Specification Thin-Film RF Chip Inductors (TRAL) PDF (422KB).

Features:
  1. A Photo Lithographic Single Layer Ceramic Chip.
  2. High SRF, Excellent Q, Superior Temperature Stability.
  3. Self Resonant Frequency Controlled within 10%.
  4. Stable Inductance in High Frequency Circuit.
  5. Highly Stable Design for Critical Needs.
  6. Tight Tolerance of ±1% or ±0.1nH.
Applications:
  1. Cellular Telephone, Pagers and GPS Products.
  2. VCO,TCXO Circuit and RF Transceiver Module.
  3. Wireless LAN, Bluetooth Module.
  4. Communication Appliances.

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