Metal Strip chip high Power Low Ohmic Resistors (LRP)
Things go better with DeMint (LRP) high power metal strip resistors.
(LRP) Low ohm metal strip resistors from DeMint Electronics offer a wide range of high-power current sensing applications including power management of NB, MB and monitor, automotive, shunts and power amplifiers, DC-DC converter and charger, test & measurement instruments, linear power supplies and switching.
(LRP) Design for applications that require high power handling (Up to 3W) and low resistance values from 7mΩ to 100mΩ and come with a range of advantages including a wide temperature range and a varied choice of wide range package sizes 2512 with high current capability.
DeMint (LRP) is aiming for very high power-to-footprint size ratio, excellent frequency response and very low inductance in a solid metal nickel-chrome or manganese-copper allow resistive element with Low TCR ±50PPM/°C. Also, ideal for all types of voltage division, current sensing and pulse applications.
Downloads Complete Specification PDF (415KB) Metal Strip chip high Power Low Ohmic Resistors (LRP).
Contact us with your specific needs.
- Customized Resistance Available.
- Low TCR ±50PPM/°C, ±75PPM/°C.
- High power rating from 1 Watts to 3 Watts
- Low resistance values from 7mΩ to 100mΩ.
- Without Laser Trimmed with very low inductance.
- For NB power management.
- For MB power management.
- For Monitor power management.
- SWPS: DC-DC converter, Charger, Adaptor.
| Dimensions Chip 2512 (LRP) | ||||||
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| Type | Dimensions (Inch) | L(mm) | W(mm) | T(mm) | D(mm) | |
| LRP12 | 2512 | 6.40±0.25 | 3.20±0.25 | 0.70±0.20 | 0.90±0.30 | |
Chip 2512 Dimensions (LRP)| Construction (LRP) | |||||
| a | b | c | d | e | f |
| Overcoat | Marking | Alloy Plate | Internal Electrode | Barrier Layer | Solder Plating |
Notice : DeMint is capable of manufacturing the optional spec based on customer's requirement.
| Electrical Specifications Chip 2512 (LRP) | |||||
| Type | Power Rating at 70°C | Operating Temp. Range | Resistance Tolerance (±%) | Resistance (mΩ) | TCR (±PPM/°C) |
| LRP12 (2512) | 1W, 2W, 3W | -55°C ~ +170°C | ±0.5%, ±1%, ±5% | 15, 18, 20, 22, 25, 30, 33, 35, 39, 40, 47, 50, 60, 68, 70, 75, 80, 82, 90, 91, 100 | ±50 |
| 7, 8, 9, 10, 12, 15, 18, 20, 22, 25, 30, 33, 35, 39, 40, 47, 50, 60, 68, 70, 75, 80, 82, 90, 91, 100 | ±75 | ||||
| Operating Current I = √ ( P / R ) , Operating Voltage V = √ ( P * R ) DeMint is capable of manufacturing the optional spec based on customer’s requirement. |
| Derating Curve (LRP) | |
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(LRP) Power Derating Curve| Recommend Land Pattern (LRP) | ||||
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| Type | A (mm) | B (mm) | C (mm) | |
| LRP12 | 4.00 | 2.00 | 3.50 | |
＊FR4 copper board, 100μm of copper pad thickness
| Packing Quantity & Reel Specifications (LRP) | |||||||||
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| Type | Packaging Quantity | Tape Width | Reel Diameter | ΦA (mm) | ΦB (mm) | ΦC (mm) | W (mm) | T (mm) | |
| LRP12 | Embossed 4,000 pcs | 12 mm | 7 inch | 178.0±1.5 | 60.0±1.0 | 13.0±0.5 | 13.0±1.0 | 15.5±0.5 | |
| Emboss Plastic Tape Specifications (LRP) | ||||||||||||
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| Type | A (mm) | B (mm) | W (mm) | E (mm) | F (mm) | P0 (mm) | P1 (mm) | P2 (mm) | ΦD0 (mm) | ΦD1 (mm) | T | |
| LRP12 | 3.50±0.10 | 6.70±0.10 | 12.0±0.30 | 1.75±0.10 | 5.5±0.05 | 4.0±0.10 | 4.0±0.10 | 2.0±0.05 | 1.50±0.10 | 1.50±0.25 | 1.2±0.15 | |
Low Ohm Metal Strip (LRP) Emboss Plastic Tape Specifications| Notice : | 1. The cumulative tolerance of 10 sprocket hole pitch is ±0.2mm. 2. Carrier camber shall be not more than 1mm per 100mm through a length of 250mm. 3. A & B measured 0.3mm from the bottom of the packet. 4. t measured at a point on the inside bottom of the packet to the top surface of the carrier. 5. Pocket position relative to sprocket hole is measured as the true position of the pocket and not the pocket hole. |
| Soldering Condition (Reflow soldering only) (LRP) | |
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(LRP) Reflow Soldering| Environmental Characteristics (LRP) | ||
| Item | Requirement | Test Method |
| Thermal Shock | ±1% |
IEC-60115-1 4.19 JIS-C-5201-1 4.19 -55°C ~ 155°C, 5 cycles |
| Short Time Overload | ±1% |
IEC60115-1 4.13 JIS-C-5201-1 4.13 5*rated power for 5 seconds |
| Low Temperature Storage | ±1% |
IEC-60115-1 4.23.4 JIS-C-5201-1 4.23.4 at-55°C for 1000 hrs |
| Biased Humidity | ±1% |
MIL-STD-202 Method 103 1000 hrs 85°C/85% RH 10% of operating power |
| Bending Stength | ±1% |
IEC-60115-1 4.33 JIS-C-5201-1 4.33 Bending width 2mm once for 5 seconds |
| Endurance | ±1% |
IEC60115-1 4.25 JIS-C-5201-1 4.25.1 70±2°C, RCWV for 1000 hrs with 1.5 hrs “ON” and 0.5 hrs “OFF” |
| Dry Heat | ±1% |
IEC60115-1 4.23.2 JIS-C-5201-1 4.23.2 at +170°C for 1000 hrs |
| Resistance to Soldering Heat | ±0.5% |
IEC-60115-1 4.18 JIS-C-5201-1 4.18 260±5°C, for 10 seconds |
| Insulation Resistance | >100MΩ |
IEC60115-1 4.6 JIS-C-5201-1 4.13 100V DC for 1 minute |
| Solderability | 95% min coverage |
IEC-60115-1 4.17 JIS-C-5201-1 4.17 245±5°C for 3 seconds |
| Temperature Coefficient of Resistance (T.C.R.) | As Spec. |
IEC60115-1 4.8 JIS-C-5201-1 4.8 -55°C ~+125°C. (25°C is the reference temperature) |
| Rated continuous Working Voltage (RCWV) = √ Power Rating × Resistance Value (Ω)
or Max. Operating voltage whichever is lower. Storage Temperature: 25±3°C; Humidity < 80%RH; |
| Order Codes (LRP) | ||||||||||||||||||||||||||||||||||||||||||||||||
| LRP | 12 | F | TR | D | S | R050 | ||||||||||||||||||||||||||||||||||||||||||
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